Manufacturing Procedure – Without Security#
This section outlines the sequence for programming devices without security.
Before proceeding with the following steps for Common flash or Dual flash mode, ensure that the flash mode is selected (Flash Mode Selection – No In-Package Flash OPN) for no in-package flash OPN.
Note: This section contains two manufacturing sequence of steps for both Common Flash Mode and Dual Flash Mode. Depending on the user's configuration, only one of these sections needs to be followed
Common Flash Mode#
The following sequence needs to be followed for manufacturing procedure without security in common flash mode.
| Steps | Description | Command (Syntax) |
|---|---|---|
| 1 | Backup – IPMU Calibration data |
commander manufacturing read <efuseipmu|taipmu> --out <filename.bin> -d <OPN Number> [--pinset n]
|
| 2 | MBR Provisioning |
commander manufacturing provision -mbr <filename.bin|default> -d <OPN Number> [--skipload] [--pinset n]
|
| 3 | Boot Configurations Update in eFuse (Optional) | Refer to the section Boot Configurations Update – eFuse |
| 4 | RF (Frequency and Gain Offset) Calibration | Refer to section RF Calibration for calibration steps. |
| 5 | Load NWP and M4 Firmware Images |
commander rps load <filename.rps> -d <OPN Number>
Note: If you want to load a combined image (NWP + M4) instead of individual NWP and M4 images, refer to the section Combined Image (NWP + M4) for combined image related information. |
Dual Flash Mode#
The following sequence must be followed for the manufacturing procedure without security in dual flash mode.
To configure devices with an in-package flash to dual flash mode, user must set the dual flash bits in the TA MBR (see the dual_flash.json file).
Note:
For dual flash mode and no in-package flash devices – you must mention the [--pinset n] in the manufacturing commands.
Flash pinset is as below for SiWG917
Flash Pinset no
GPIO set
0
GPIO 0 to 5
2
GPIO 46 to 51
3
GPIO 52 to 57
| Step | Description | Command (Syntax) |
|---|---|---|
| 1 | Backup – IPMU Calibration data |
commander manufacturing read <efuseipmu|taipmu> --out <filename.bin> -d <OPN Number> [--pinset n]
|
| 2 | Write NWP MBR with dual flash bits enabled (using dual_flash.json file) |
|
| 3 | Write M4 MBR |
commander manufacturing write m4mbrdf -data <filename.bin|filename.json> -d <OPN Number> [--skipload] [--pinset n]
|
| 4 | Write IPMU calibration data to M4 |
Read IPMU (taipmu – In-package flash OPN, efuseipmu – No In-package flash OPN)
Write M4 IPMU |
| 5 | Boot Configurations Update in eFuse (Optional) | Refer to the section Boot Configurations Update – eFuse |
| 6 | RF (Frequency and Gain Offset) Calibration | Refer to section RF Calibration for calibration steps. |
| 7 | Load NWP and M4 Firmware Images |
commander rps load <filename.rps> -d <OPN Number>
Note: If you want to load a combined image (NWP + M4) instead of individual NWP and M4 images, refer to the section Combined Image (NWP + M4) for combined image related information. |
Example: SiWG917M111MGTBA (Common Flash Mode)#
The manufacturing procedure without security for SiWG917M111MGTBA OPN in common flash mode is as follows
Backup – IPMU Calibration
commander manufacturing read taipmu --out filename.bin -d SiWG917M111MGTBA
MBR Provisioning
commander manufacturing provision –mbr default -d SiWG917M111MGTBA
RF Calibration – Refer to section RF Calibration.
Load NWP and M4 Images
NWP Image
commander rps load SiWG917-B.2.12.2.1.0.9.rps -d SiWG917M111MGTBAM4 Image
commander rps load si91x_hello_world.rps -d SiWG917M111MGTBA
Note: If no MBR is present in the device, you will see 0xa0ac error.